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Amkor Technology

CHIPS Act Recipient

Semiconductor — OSAT (Packaging & Test)

Tempe, AZ

Amkor is one of the world's largest semiconductor packaging and test providers. Their new Peoria, AZ facility is the first advanced OSAT fab built in the United States in decades.

CHIPS Act Investment

$400M (for Arizona OSAT facility)

How Vestran Serves Amkor Technology

  • Advanced packaging process knowledge capture as Amkor builds U.S. domestic expertise
  • Equipment health monitoring for wire bond, flip chip, and advanced packaging tools
  • Workforce readiness for 2,000+ new packaging technician roles in Arizona
  • Downtime prevention in high-volume assembly operations where output rates are tightly scheduled
See Vestran in Action for Amkor TechnologyStart Amkor Technology Workspace

This profile is generated from publicly available information. Vestran does not have access to proprietary company data. This page demonstrates how Vestran would be configured for your facility type and manufacturing focus.

U.S. Locations

  • Tempe, AZ (HQ)
  • Peoria, AZ (new OSAT facility)

Manufacturing Focus

Advanced packagingTestAssembly

Key Technologies

FOPLPSiPFlip chipWire bond2.5D/3D packaging

Fab Types

Advanced packaging

Employees

Global: 33,000

U.S.: ~1,200

amkor.com ↗